3D X-AI Chip: A hundred-fold leap in performance with near-zero power consumption

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In the vast sea of science and technology, a dazzling star has quietly risen, which is not only a bright spark of scientific and technological progress but also a splendid chapter of weaving dreams into reality - this is the 3D X-AI chip, a magical masterpiece that is like travelling through the future sci-fi dreamland, which is the 3D X-AI chip shockingly released by NEO. This is NEO's 3D X-AI chip, a miraculous device that seems to come out of a science fiction movie.

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If the traditional AI chip is a brave knight wielding the long sword of algorithms to cut through the thorns on the data battlefield, then the 3D X-AI chip is the superhero wearing the future armour, which has eclipsed all the old rules with its arrival. Inside the chip, there is an exquisite micro-universe, in which data storage and data processing are no longer unattainable stars, but are skillfully woven into a magical tapestry called “3D X-DRAM”.

In this tapestry, each thread contains endless wisdom and power, they are not only the carrier of data but also the embodiment of neurons and synapses. Imagine, in this three-dimensional woven ocean, data is like a babbling brook, freely shuttling between the intricate neural networks, and each neuron is like a spark of wisdom endowed with life, they are connected, they stimulate each other, and they analyze the mysteries of information at an amazing speed, pushing the performance of neural networks to an unprecedented high level - a whole 100 times higher. A full 100-fold increase.

What's even more amazing is that all this miracle works with virtually no additional energy consumption. Like a lithe dancer, dancing under the moonlight with grace and efficiency, the 3D X-AI chip reduces power consumption by 99%, as if its very existence is an elegant challenge to the limits of energy efficiency.

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It's not just a chip, it's the key to the future AI era. While HBM and other high-bandwidth memories are still struggling to catch up with the pace of the data era, 3D X-AI has elegantly surpassed it all, redefining the design philosophy of AI chips by itself and opening up a whole new shipping lane for the optimization of AI workloads.

In the microscopic wonderland of science and technology, a single 3D X-AI chip is like an exquisite three-dimensional castle, with its complex and orderly internal structure, layered on top of each other, building up a total of 300 layers of towering 3D DRAM towers, with each layer glowing with the light of 128Gb of intelligence, as bright as a star. At the heart of the castle stands a unique layer of neural network circuits, a gathering place for 8,000 intelligence warriors - neurons - ready to lead the data flood in a battle of wits.

Imagine the astonishing AI processing throughput when this castle is in full operation, as if it opens a high-speed channel to the information universe, travelling through the ocean of data at the amazing speed of 10 TB/s, invulnerable and omnipresent.

However, the real miracle lies in the fact that when 12 such castle warriors - i.e., 12 stacked HBM-encapsulated 3D X-AI chips - fight side-by-side, their power converges into a sea, forming an unstoppable torrent. Just one leader chip can lead this legion, boosting the overall capacity to 1,536Gb (equivalent to a magnificent 192GB), and its processing throughput soars to a staggering 120 TB/s, as unstoppable as a galactic downpour.

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Traditional AI chips are like knights on an ancient battlefield, riding processor warhorses, holding HBM spears, and fighting side by side with GPU wizards, but their cooperation is always limited by the speed of transmission between the spears and the staffs, and each handover drains the power and slows down the pace. 3D X-AI chips, on the other hand, are the wizards of the new era, which perfectly integrate synapses and neurons into one, as if all the magic rituals were completed inside the castle, without the need for cumbersome transmission from the outside world, and directly use the memory as a stage to stage a highly efficient and long-lasting wisdom feast. 3D DRAM, the key that opens up unlimited possibilities, not only improves the performance of AI chips, but also gives it unprecedented sustainability, allowing technology to be more sustainable, and more efficient and sustainable. it unprecedented sustainability, making every step of technology more solid.”